GT70 - Abstract Preview
GT70
Symposium: S01 - General Session
Poster Presentation
 
 

Polystyrene/MoS2@Oleylamine polymer composites for potential application as low-dielectric material in microelectronics

Landi Giovanni (1), Altavilla Claudia (2), Ciambelli Paolo (3), Neitzert Heinrich C. (4), Iannace Salvatore (5), Sorrentino Andrea (5)*

(1) IPCB - UNISA - Salerno - Italy, (2) IPCB-CNR - Portici - Napoli - Italy, (3) UNISA - NANO_MATES - Salerno - Italy, (4) UNISA - Salerno - Italy, (5) IPCB-CNR - Portici - Napoli - Italy

Insulating materials plays a vital role in the design and performance of electrical systems for both steady state and transient state conditions. In this field, polymer nanocomposites promise to offer exciting improvements for dielectric and insulating materials. Many studies in the last decade has witnessed significant developments in the area of nano-dielectric materials and significant effects of nano-scale fillers on electric, thermal and mechanical properties of polymeric materials have been observed. However, the developments of new and advanced materials to be used the miniaturization of electronic devices fabrication require extensive studies on electrical insulation characteristics of these materials before they can be used in commercial systems. In this work, Polystyrene (PS) composites were prepared by the blend solution method using MoS2@Oleylamine nanosheets as filler. The presence of the organic coating, the 2D inorganic nanosheets have showed to have a strong affinity with the polymers matrix. The dielectric properties of the blend based on polystyrene and MoS2@Oleylamine have been investigated at 300K and in the frequency range between 1000 Hz and 1 MHz. The addition of the MoS2@Oleylamine nanosheets leads to a decreasing of the relative dielectric constant and of the electrical conductivity measured in the voltage range between ±500V. Thanks to a possibility to tune the electrical permittivity with the control of MoS2 concentration, the nanocomposite could be used as a low-dielectric material in the microelectronics applications.