During the molding process residual stresses are formed due to thermal contraction during cooling as well as the local pressure history during solidification. In this presentation I will show a simple analytical model which relates residual stresses, product shrinkage as well as warpage to the temperature and pressure histories during molding. Precise eximer laser layer removal measurements were performed to verify the predicted residual stress distributions. In addition, detailed shrinkage and warpage measurements on a large series of polymers and for different molding conditions were performed and are shown to compare well with the model predictions.